(No.58 Research Institute of China Electronics Technology Group Corporation， Wuxi 214035，China)
Abstract： With the advent of the post-Moore era, it has become a new direction for the development of the integrated circuit industry to meet the miniaturization and integration of the system through system-level packaging technology. In view of the large demand for low power consumption, miniaturization and integration of controllers in the current market, this paper proposes a system-level packaging technology. Based on a series of design methods such as principle design, package structure design, layout design, signal integrity simulation, power integrity simulation, and thermal stress simulation, combined with the current domestic manufacturing process level, a fully localized controller integrated chip was developed. The integrated chip takes FPGA as the control core, integrates the RF local oscillator signal source and DDS signal source, and realizes the functions of control, output and communication of the RF signal source. Finally, through the test and verification of the sample, the chip has stable function and reliable index, which meets the requirements of technical indicators. Compared with the controller board, the designed integrated chip greatly reduces the power consumption of the product, realizes the miniaturization and integration of the controller, meets the current market application requirements, and provides technical and feasibility reference for the subsequent research of controller integrated chips.
Key words : system in package；controller；integrated chip；RF signal source
【引言】
目前，集成電路芯片制造工藝的特征尺寸已到達(dá)5 nm，制造工藝的特征尺寸開始向3 nm甚至1 nm邁進(jìn)，遵循摩爾定律的晶體管特征尺寸等比例縮小的發(fā)展趨勢已開始放緩，成本卻在大幅提高，而且集成電路技術(shù)的工藝節(jié)點也逐步接近其物理極限，集成電路行業(yè)已進(jìn)入后摩爾時代[1]。在后摩爾時代，通過系統(tǒng)級封裝技術(shù)（System in Package，SiP）來實現(xiàn)片上系統(tǒng)的小型化、多功能化和集成化已成為集成電路行業(yè)發(fā)展的新方向。
