中圖分類號(hào)：TN47 文獻(xiàn)標(biāo)志碼：A DOI: 10.16157/j.issn.0258-7998.256992 中文引用格式： 段玉賀，黎蕾，王輅，等. 大數(shù)據(jù)綜合信息處理SiP電路設(shè)計(jì)[J]. 電子技術(shù)應(yīng)用，2026，52(3)：56-60. 英文引用格式： Duan Yuhe，Li Lei，Wang Lu，et al. Design of SiP circuit for big data integrated information processing[J]. Application of Electronic Technique，2026，52(3)：56-60.
Design of SiP circuit for big data integrated information processing
Duan Yuhe，Li Lei，Wang Lu，Zhang Jinghui，Zhu Minqi
The 58th Research Institute of China Electronics Technology Group Corporation
Abstract： In order to meet the complex requirements of electronic equipment such as miniaturization, high performance, rapid development and information processing capabilities, a big data cleaning integrated information processing SiP circuit based on advanced System-in-Package (SiP) technology was designed. The circuit adopts a domestically produced bare core, realizes the system integration of multiple micro components through 3D Through-Silicon Via (3D TSV) and modular multiplexing technology, supports the adaptive interference suppression function of multiple airspace directions at the same time, supports the interference suppression ability of large-scale unmanned swarm, and meets the real-time computing capability requirements of big data cleaning. The circuit is 90% smaller and 85% lighter than the board. Through multi-physics simulation and practical testing, the circuit meets the development requirements and has application prospects in the field of UAV swarms.
Key words : system-in-package；miniaturization；signal processing；3D through-silicon via；modular reuse
